講座名稱：三維集成的過(guò)去和未來(lái)

講座時(shí)間：2019-08-30 9:30:00

講座地點(diǎn)：北校區(qū)東大樓220

講座人：張國(guó)飆 教授

講座人介紹：

Dr. Guobiao ZHANG is a professor at Southern University of Science and Technology. He received Ph.D. degree from Berkeley under Chenming HU in 1995. He worked at Texas Instrument for five years before started 3D-ROM INC. Dr. Zhang is an inventor of 3-D memory and 3-D computation. He owns over 100 hundred patents, most of which are the U.S. patents. Intel’s 3D-XPoint and YMTC’s Xtacking used Dr. Zhang’s patented technologies.

講座內(nèi)容：

At the 7nm node, transistors do not have many generations to go. As future scaling of transistors is expected to become stalled around year 2026-2030, 3-D Integration is now considered as one of the most promising candidates. The 3-D integration can be carried out at two levels: integrated circuit (IC) level (i.e. monolithic 3D-IC) and packaging level (i.e. 3D-packaing). In this talk, both monolithic 3D-IC and 3D-packaing will be covered by industrial veterans. Several important milestones during the development of the monolithic 3D-IC and 3D-packaing will be discussed.

主辦單位：微電子學(xué)院